TERMOFLEX® FILL, INSULATING PAD FOR UNDERFLOOR WATER HEATING

Packaging chips from expanded polystyrene granulate as packing and protective material for packaging and transportation.


  Properties

  - fills up and packs the packaging

  - low bulk density and weight

  - protects the goods during transportation

  - it contains 99.5% of air

  

 Scope of use

TERMOFLEX® FILL consists of packaging chips from polystyrene granulate with low bulk density and high mechanical strength. They have the ability to fill tightly each free space and adapt to ant shape.

They contain only 0,5% of artificial material and 99,5% air. Thus with maximum air and minimum material, every object could be very well protected during shipment, without increasing the gross weight.

It is recommended as packing and protective material for packaging and transportation of fine breakable and fragile objects (electron plates and appliances, glassware, porcelain articles, etc.)

  

Indicative consumption

depending on the size of the packaging

 

Package

bulk